graph LR
subgraph "三相PFC升压级"
A[三相380VAC输入] --> B[EMI滤波器与浪涌保护]
B --> C[三相整流桥]
C --> D[PFC电感]
D --> E[PFC开关节点]
E --> F["VBMB17R11S \n 700V/11A SJ_Multi-EPI"]
F --> G[高压直流母线 500-700VDC]
H[PFC控制器] --> I[隔离栅极驱动器]
I --> F
G -->|电压反馈| H
end
subgraph "LLC谐振变换级"
G --> J[LLC谐振腔 Lr, Cr]
J --> K[高频变压器初级]
K --> L[LLC开关节点]
L --> M["VBMB17R11S \n 700V/11A SJ_Multi-EPI"]
M --> N[初级地]
O[LLC控制器] --> P[隔离栅极驱动器]
P --> M
K -->|电流反馈| O
end
subgraph "软开关与EMC优化"
Q[有源钳位电路] --> F
Q --> M
R[RC吸收网络] --> F
R --> M
S[共模滤波器] --> B
end
style F fill:#e8f5e8,stroke:#4caf50,stroke-width:2px
style M fill:#e8f5e8,stroke:#4caf50,stroke-width:2px
大电流动态负载模拟器拓扑详图
graph TB
subgraph "多相并联功率级"
A[48-120V低压总线] --> B[电流分配网络]
B --> C["相位1: VBGL11205 \n 130A @4.4mΩ"]
B --> D["相位2: VBGL11205 \n 130A @4.4mΩ"]
B --> E["相位3: VBGL11205 \n 130A @4.4mΩ"]
B --> F["相位4: VBGL11205 \n 130A @4.4mΩ"]
subgraph "均流与热平衡"
G[电流传感电阻阵列]
H[温度监控点]
I[动态均流控制]
end
C --> J[输出滤波电感]
D --> J
E --> J
F --> J
J --> K[大电流输出端子]
K --> L[飞行汽车电池接口]
C --> G
D --> G
E --> G
F --> G
G --> I
H --> I
I --> C
I --> D
I --> E
I --> F
end
subgraph "控制与保护"
M[数字PWM控制器] --> N[大电流栅极驱动器]
N --> C
N --> D
N --> E
N --> F
O[逐周期过流保护] --> M
P[退饱和检测] --> M
Q[温度保护] --> M
end
style C fill:#e3f2fd,stroke:#2196f3,stroke-width:2px
style D fill:#e3f2fd,stroke:#2196f3,stroke-width:2px
精密作动器H桥驱动拓扑详图
graph LR
subgraph "H桥驱动通道"
A[24V/48V辅助总线] --> B[上桥臂开关]
B --> C[输出节点A]
C --> D[作动器负载]
D --> E[输出节点B]
E --> F[下桥臂开关]
F --> G[功率地]
subgraph "MOSFET配置"
H["Q1: VBE1638A \n 60V/45A @21mΩ"]
I["Q2: VBE1638A \n 60V/45A @21mΩ"]
J["Q3: VBE1638A \n 60V/45A @21mΩ"]
K["Q4: VBE1638A \n 60V/45A @21mΩ"]
end
A --> H
H --> C
C --> D
D --> E
E --> I
I --> G
B --> J
J --> C
C --> D
D --> E
E --> K
K --> G
end
subgraph "驱动与控制"
L[半桥驱动器IC] --> H
L --> I
M[半桥驱动器IC] --> J
M --> K
N[MCU PWM] --> L
N --> M
subgraph "保护电路"
O[自举电源]
P[电流检测]
Q[续流二极管]
R[TVS保护]
end
O --> L
O --> M
P --> N
Q --> H
Q --> I
R --> C
R --> E
end
style H fill:#fff3e0,stroke:#ff9800,stroke-width:2px
style I fill:#fff3e0,stroke:#ff9800,stroke-width:2px
热管理与保护系统拓扑详图
graph LR
subgraph "分级热管理系统"
A["一级冷却: 液冷板"] --> B["VBGL11205阵列 \n TO-263封装"]
C["二级冷却: 强制风冷"] --> D["VBMB17R11S阵列 \n TO-220F封装"]
E["三级冷却: PCB敷铜"] --> F["VBE1638A阵列 \n TO-252封装"]
subgraph "温度监控网络"
G["NTC传感器1 \n 液冷板温度"]
H["NTC传感器2 \n 散热器温度"]
I["NTC传感器3 \n PCB温度"]
J["红外测温 \n 关键节点"]
end
G --> K[温度采集MCU]
H --> K
I --> K
J --> K
K --> L[风扇PWM控制器]
K --> M[水泵速度控制器]
L --> N[冷却风扇阵列]
M --> O[液冷循环泵]
end
subgraph "电气保护网络"
P["RCD缓冲电路"] --> Q["高压开关管"]
R["RC吸收电路"] --> S["大电流开关管"]
T["TVS阵列"] --> U["栅极驱动芯片"]
V["肖特基二极管"] --> W["同步整流路径"]
X["电流霍尔传感器"] --> Y["比较器与锁存"]
Y --> Z[故障关断信号]
Z --> Q
Z --> S
end
style B fill:#e3f2fd,stroke:#2196f3,stroke-width:2px
style D fill:#e8f5e8,stroke:#4caf50,stroke-width:2px
style F fill:#fff3e0,stroke:#ff9800,stroke-width:2px