graph LR
subgraph "SiC PFC/LLC主电源"
A["AC输入(85-265VAC)"] --> B["EMI滤波器"]
B --> C["桥式整流器"]
C --> D["PFC升压电感"]
D --> E["PFC开关节点"]
E --> F["VBP165C40-4L \n 650V SiC MOSFET"]
F --> G["400VDC母线"]
H["SiC PFC控制器"] --> I["专用SiC驱动器"]
I --> F
G --> J["LLC谐振网络"]
J --> K["高频变压器"]
end
subgraph "中间总线与POL架构"
K --> L["变压器次级"]
L --> M["同步整流节点"]
M --> N["VBGL1806 \n 80V/95A MOSFET"]
N --> O["48V中间总线"]
O --> P["多相降压控制器"]
P --> Q["相位1: VBGL1806"]
P --> R["相位2: VBGL1806"]
Q --> S["CPU核心供电(1.8V)"]
R --> S
O --> T["负载点转换器"]
T --> U["ASIC供电(3.3V/1.2V)"]
T --> V["DDR供电(1.35V)"]
end
subgraph "数字电源管理"
W["BMC/Power Manager"] --> X["PMBus接口"]
X --> H
X --> P
W --> Y["故障监测与保护"]
Y --> Z["过流/过温/过压保护"]
end
style F fill:#e8f5e8,stroke:#4caf50,stroke-width:2px
style N fill:#e3f2fd,stroke:#2196f3,stroke-width:2px
PoE端口管理与热插拔拓扑详图
graph LR
subgraph "PoE端口功率管理通道"
A["48V中间总线"] --> B["PoE供电控制器"]
B --> C["端口1管理"]
B --> D["端口2管理"]
B --> E["端口N管理"]
subgraph C["端口1详细电路"]
direction LR
C1["检测与分级电路"] --> C2["VBA3316SA \n 双N-MOSFET开关"]
C2 --> C3["电流检测电阻"]
C3 --> C4["以太网变压器"]
C4 --> C5["RJ45连接器"]
C5 --> C6["PD设备"]
end
subgraph D["端口2详细电路"]
direction LR
D1["检测与分级电路"] --> D2["VBA3316SA \n 双N-MOSFET开关"]
D2 --> D3["电流检测电阻"]
D3 --> D4["以太网变压器"]
D4 --> D5["RJ45连接器"]
D5 --> D6["PD设备"]
end
subgraph "保护电路"
F["TVS阵列 \n 浪涌保护"] --> C5
F --> D5
G["热插拔控制"] --> H["浪涌电流限制"]
H --> C2
H --> D2
end
end
subgraph "热插拔与冗余电源"
I["电源模块1"] --> J["OR-ing MOSFET"]
K["电源模块2"] --> L["OR-ing MOSFET"]
J --> M["背板电源总线"]
L --> M
M --> N["热插拔控制器"]
N --> O["板卡电源输入"]
O --> P["软启动电路"]
P --> Q["板卡负载"]
subgraph "故障保护"
R["过流保护"] --> S["快速关断"]
T["过压保护"] --> U["钳位电路"]
end
N --> R
N --> T
end
style C2 fill:#fff3e0,stroke:#ff9800,stroke-width:2px
style D2 fill:#fff3e0,stroke:#ff9800,stroke-width:2px
热管理与可靠性拓扑详图
graph LR
subgraph "三级热管理架构"
A["一级热源: POL转换器"] --> B["强制风冷散热"]
C["二级热源: 电源模块"] --> D["混合冷却 \n (风冷+导热)"]
E["三级热源: 端口开关"] --> F["自然散热+PCB敷铜"]
subgraph B ["强制风冷细节"]
direction TB
B1["温度传感器"] --> B2["PWM风扇控制器"]
B2 --> B3["多风扇阵列"]
B3 --> B4["定向风道设计"]
B4 --> A
end
subgraph D ["混合冷却细节"]
direction TB
D1["SiC MOSFET"] --> D2["导热基板"]
D2 --> D3["机壳散热"]
D4["内部风道"] --> D1
end
subgraph F ["自然散热优化"]
direction TB
F1["厚铜PCB设计"] --> F2["热过孔阵列"]
F3["散热焊盘"] --> F4["环境气流"]
end
end
subgraph "电气保护网络"
G["SiC专用驱动保护"] --> H["RC缓冲电路"]
H --> I["VBP165C40-4L"]
J["过压保护"] --> K["TVS管阵列"]
K --> L["栅极驱动芯片"]
M["端口浪涌保护"] --> N["GDT/TVS组合"]
N --> O["VBA3316SA端口"]
P["电流检测"] --> Q["比较器与锁存"]
Q --> R["故障关断信号"]
R --> I
R --> O
end
subgraph "可靠性增强设计"
S["电压降额设计 \n (80%原则)"] --> T["VBGL1806: 48V→64V"]
U["电流降额设计"] --> V["根据壳温曲线降额"]
W["寿命预测算法"] --> X["BMC健康度监控"]
end
style I fill:#e8f5e8,stroke:#4caf50,stroke-width:2px
style O fill:#fff3e0,stroke:#ff9800,stroke-width:2px