graph LR
subgraph "输入保护网络"
A[车辆电池输入] --> B["TVS阵列 \n ISO7637-2标准"]
B --> C["π型滤波器 \n LC+共模电感"]
C --> D[输入电容组]
end
subgraph "主路径开关控制"
D --> E[主开关节点]
E --> F["VBGL1105 \n 100V/125A TO-263"]
F --> G[主电源总线]
H[专用驱动IC] --> I[驱动信号]
I --> F
J[电流检测放大器] --> K[比较器]
K --> L[故障锁存]
L --> H
M[温度传感器] --> N[温度监控]
N --> L
end
subgraph "机械加固设计"
O[TO-263封装] --> P[散热基板]
P --> Q[机械固定夹]
R[PCB] --> S[散热过孔阵列]
S --> P
end
style F fill:#e8f5e8,stroke:#4caf50,stroke-width:2px
高效DC-DC功率转换拓扑详图
graph LR
subgraph "多相同步Buck转换器"
A[主电源总线] --> B[输入电容阵列]
B --> C[上桥臂开关节点]
C --> D["VBQA1806 \n 上桥臂MOSFET"]
D --> E[相位节点]
E --> F[功率电感]
F --> G[输出电容阵列]
G --> H[CPU核心电源]
I[下桥臂开关节点] --> J["VBQA1806 \n 下桥臂MOSFET"]
J --> K[功率地]
E --> I
end
subgraph "多相控制器与驱动"
L[多相Buck控制器] --> M[相位1驱动]
L --> N[相位2驱动]
L --> O[相位3驱动]
M --> D
M --> J
P[电压反馈] --> L
Q[电流平衡检测] --> L
end
subgraph "高频布局优化"
R[DFN8封装] --> S[紧凑布局]
T[功率回路] --> U[最小化寄生电感]
V[栅极驱动路径] --> W[低阻抗走线]
X[散热过孔] --> Y[内部散热层]
end
style D fill:#e3f2fd,stroke:#2196f3,stroke-width:2px
style J fill:#e3f2fd,stroke:#2196f3,stroke-width:2px
负载点(PoL)开关控制拓扑详图
graph LR
subgraph "P-MOS高侧开关通道"
A[负载分配总线] --> B[开关输入]
B --> C["VBTA8338 P-MOSFET \n SC75-6封装"]
C --> D[开关输出]
D --> E[LDO/DC-DC转换器]
E --> F[负载模块]
G[MCU GPIO] --> H[电平转换]
H --> I[栅极驱动]
I --> C
end
subgraph "多路负载管理"
J[电源序列控制器] --> K[使能信号1]
J --> L[使能信号2]
J --> M[使能信号3]
K --> N["通道1:传感器"]
L --> O["通道2:存储"]
M --> P["通道3:通信"]
Q[电流监测] --> R[功耗统计]
R --> S[动态电源管理]
S --> J
end
subgraph "热分布设计"
T[SC75-6封装] --> U[分散布局]
V[热耦合分析] --> W[间距优化]
X[局部敷铜] --> Y[自然散热]
end
style C fill:#fff3e0,stroke:#ff9800,stroke-width:2px
热管理与系统保护拓扑详图
graph LR
subgraph "三级热管理架构"
A["一级:散热基板 \n 主功率器件"] --> B["VBGL1105/VBQA1806"]
C["二级:PCB敷铜层 \n 负载开关"] --> D["VBTA8338阵列"]
E["三级:自然对流 \n 控制IC"] --> F["MCU/驱动IC"]
G[温度传感器网络] --> H[多点温度采集]
H --> I[热监控MCU]
I --> J[PWM风扇控制]
I --> K[动态频率调整]
J --> L[冷却风扇]
K --> M[降低开关频率]
end
subgraph "电气保护网络"
N["输入保护"] --> O["TVS/压敏电阻"]
P["过流保护"] --> Q["电流检测+比较器"]
R["过温保护"] --> S["温度传感器+锁存"]
T["欠压锁定"] --> U["电压监控IC"]
O --> V[主电源路径]
Q --> V
R --> W[所有MOSFET]
U --> X[控制电源]
end
subgraph "机械可靠性设计"
Y[TO-263固定] --> Z[机械夹/胶粘]
AA[PCB加固] --> AB[加强筋设计]
AC[连接器] --> AD[锁紧机制]
AE[振动测试点] --> AF[应变监测]
end
style B fill:#e8f5e8,stroke:#4caf50,stroke-width:2px
style D fill:#fff3e0,stroke:#ff9800,stroke-width:2px